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I. MARIN1,* , V. CIUPINA1, G. PRODAN1, I. M. OANCEA STANESCU1
Thermionic vacuum arc (TVA) is a growth technique among others (pulsed laser deposition, electron beam deposition, thermal evaporation) used in fabrication for solid-state electronic devices, sensing devices, information storage. Electrical and magnetical properties behaviour of thin films depends of grain size. An important characteristic of thin film technologies is the possibility to control the grain size. A few applications of the effect of the final mean grain size on the properties of thin films are spintronic devices. In TVA deposition there are different methods for controlling grain size including the distance between cathode and anode or the relativ position of the two electrodes. In this paper we present TEM (Philips CM 120 ST) analysis on MgO-Co multilayers prepared by TVA method, demonstrating the uniform distribution of the grains and their nm-scale as shown in the histogram..
Multilayers, Grain size, Feret diameter, TEM.
I. MARIN, V. CIUPINA, G. PRODAN, I. M. OANCEA STANESCU, Analysis of grain size in MgO-Co multilayers using TEM investigations, Optoelectronics and Advanced Materials - Rapid Communications, 6, 5-6, May-June 2012, pp.606-609 (2012).
Submitted at: July 8, 2011
Accepted at: June 6, 2012
Optoelectronics and Advanced Materials - Rapid Communications
(2023): 0.5 - 2023 Journal Citation Reports (Clarivate Analytics, 2024)
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