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Deposition of titanium nitride films on the flexible Polycarbonate substrates by magnetron sputtering

YAN-HUI LIU1, JING-LONG GAO1,* , JIA-JING LIANG1

Affiliation

  1. College of Material Science and Engineering, Shenyang Ligong University, Shenyang, Liaoning 110168, China

Abstract

Titanium nitride (TiN) thin films were deposited on polycarbonate (PC) substrates by reactive direct-current (DC) magnetron sputtering in argon and nitrogen gas mixtures at low temperature. In this study, we investigated the effects of DC sputtering power on the deposition rate and surface characteristic of TiN thin films on polymer substrates. The results show that the deposition rate is almost linearly related to DC sputtering power. The grain size of TiN decreases with increasing DC sputtering power. In addition, the film roughness is increased by the increase of DC sputtering power. Structural morphological study of the deposited thin film carried out by employing X-ray diffraction exhibits highly (200) and (220) oriented structure corresponding to TiN..

Keywords

Titanium nitride thin film, Polycarbonate substrates, Magnetron sputtering, Sputtering power.

Citation

YAN-HUI LIU, JING-LONG GAO, JIA-JING LIANG, Deposition of titanium nitride films on the flexible Polycarbonate substrates by magnetron sputtering, Optoelectronics and Advanced Materials - Rapid Communications, 9, 3-4, March-April 2015, pp.436-438 (2015).

Submitted at: Nov. 10, 2014

Accepted at: March 19, 2015