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YINHU QU1,* , XIAONI LIU1, YI LIU1, JINGJING SHI1, XIAOLE CHENG1, ZONGTUAN ZHOU1
The microstructure, resistances and composition of graphene-copper composite paste were studied by means of scanning electron microscope (SEM), four point probe tester and X-ray diffraction (XRD). The rheological behavior and conductive mechanism of the composite paste were analyzed, and the geometric model of connection of conductive phase was established. The results indicate that the resistance decreases firstly and then increases sightly with the increasing content of graphene. When the mass ratio of graphene to copper powders is 3:97, the resistance of the prepared composite paste with 5μm graphene sheets reaches to the minimum value of 2.68 mΩ·cm, which is decreased by 92.22% in comparison with copper paste. The conductive film surface of this graphene-copper composite paste is flatter and denser than that of copper paste, forming the closer contact among conductive phases. During the cooling process, surface tension of glass liquid causes pores between the copper powders and graphene shrunk to promote the rearrangement of copper powder and graphene, resulting in more conductive phase contacted compactly, and finally forming a chain structure and excellent conductive network. In the conductive film, the shorter graphene will fill into gaps among copper powders and longer graphene will form a "cross-bridge". This would be in favor of building a conductive path and promoting the conductivity of the conductive paste..
Graphene, Copper powders, Conductive paste, Resistance.
YINHU QU, XIAONI LIU, YI LIU, JINGJING SHI, XIAOLE CHENG, ZONGTUAN ZHOU, Effect of graphene on microstructure and properties of copper paste, Optoelectronics and Advanced Materials - Rapid Communications, 13, 1-2, January-February 2019, pp.141-147 (2019).
Submitted at: Feb. 14, 2018
Accepted at: Feb. 12, 2019
Optoelectronics and Advanced Materials - Rapid Communications
(2023): 0.5 - 2023 Journal Citation Reports (Clarivate Analytics, 2024)
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