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Effect of substrate choosing process on the structures and radiation-proof properties of Al films

XIN JI1,* , LIN JUN WANG1, YI MING MI2, CHAO MIN ZHANG2

Affiliation

  1. School of Materials Science & Engineering, Shanghai University, Shanghai 200444, China
  2. College of Fundamental Studies, Shanghai University of Engineering Science, Shanghai 201620, China

Abstract

Al thin films used as radiation-proof materials on textile fabrics were prepared by magnetron DC-sputtering. In the deposition, different substrate materials (Polyester, Cotton and Aramid) were chosen, resulting in different structures, morphologies and radication-proof properties. It was found that substrate choosing process was the key deposition parameter influencing the Al film phase change from cubic to tetragonal structure. Moreover, the surface roughness and grain sizes were slightly different in the films on different substrates. Finally, the optical measurements suggest that the radiation-proof properties were affected by the grain density and lattice match on the various substrates..

Keywords

Thin film, Al, Substrate choosing process, Vapor deposition, Radiation-proof properties.

Citation

XIN JI, LIN JUN WANG, YI MING MI, CHAO MIN ZHANG, Effect of substrate choosing process on the structures and radiation-proof properties of Al films, Optoelectronics and Advanced Materials - Rapid Communications, 9, 5-6, May-June 2015, pp.688-691 (2015).

Submitted at: April 25, 2015

Accepted at: May 7, 2015