Abstract
Polyvinylidene Fluoride (PVDF) is a very versatile polymer with enough potential to provide a great development in materials science and technology, due to its piezoelectricity, low energy surface, low cost, flexibility, mechanical and chemical resistances. For electrical applications, like piezoelectric sensors and actuators, for example, PVDF surface metallization is essential. This paper describes an alternative metallization method, called electroless nickel-phosphorus deposition (Ni-P), in PVDF films deposited on glass substrate with some geometric structures fabricated by Photolithography. After a wet pre-treatment to improve adherence, electroless contact layer is deposited over PVDF masked by photolithography, using the lift-off technique. This process combination is very versatile, simple and gives good results, related to the Ni-P adhesion on PVDF surface and to the pattern resolution of photolithographic structures. Chemical composition of the alloyed film were measured by SEM/EDS (Scanning Electron Microscopy - Energy Dispersive X-Ray Spectroscopy), the PVDF surface treatment was examined using Infrared Spectroscopy and the resolution of Ni-P deposition evaluated by the Scanning Electron Microscope. This work opens a possibility of a new metallization technique for PVDF piezoelectric devices..
Keywords
Polyvinylidene Fluoride (PVDF).
Citation
REINALDO ALBERTO RICCHI JR, ALEXANDER FLACKER, JOÃO SINÉZIO DE CARVALHO CAMPOS, Electroless Ni-P deposition over polyvinylidene fluoride thin films with wet acid treatment, Optoelectronics and Advanced Materials - Rapid Communications, 7, 11-12, November-December 2013, pp.891-894 (2013).
Submitted at: Jan. 14, 2013
Accepted at: Nov. 7, 2013