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RUIXIANG BAI1,* , LIANG WANG1, ZHENKUN LEI1, HAORAN CHEN1
In this paper, piezoelectric composite specimens with epoxy resin adhesive for fixed-ratio mixed-mode (FRMM) fracture tests with photoelasticity analysis were performed. The deformation and strain field are obtained by digital image correlation (DIC) technologies, and the beam theory is used to calculate the critical fracture energies for piezoelectric composites. The values of SERR were calculated using the Virtual Crack Closure Technique and the traction-separation law for VCCT and CZM approaches respectively. Good agreement of the load-displacement response was obtained between the FEA and experimental results when using CZM approach. On the other hand, although the VCCT approach cannot provide precise simulation of the crack initiation, it can be considered as an efficient alternative in modelling the crack propagation phase. Our study demonstrates the digital photoelastic FRMM test is simple and validated for piezoelectric composite and the CZM can well characterize the interface debonding fracture of piezoelectric composite materials with a weak bonding interface..
Piezoelectric composite, Fracture toughness, Finite element analysis, Debonding, Photoelasticity.
RUIXIANG BAI, LIANG WANG, ZHENKUN LEI, HAORAN CHEN, Experimental and numerical analysis of interfacial fracture in piezoelectric composites, Optoelectronics and Advanced Materials - Rapid Communications, 5, 12, December 2011, pp.1328-1335 (2011).
Submitted at: Nov. 2, 2011
Accepted at: Nov. 24, 2011
Optoelectronics and Advanced Materials - Rapid Communications
(2023): 0.5 - 2023 Journal Citation Reports (Clarivate Analytics, 2024)
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