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Fabrication of fused-silica sub-micron gratings with high aspect ratio by transfer holographic resist masks with ICP dry etching

B. WANG1,* , Y. LI2

Affiliation

  1. School of Physics and Optoelectronic Engineering, Guangdong University of Technology, Guangzhou 510006, China
  2. English Education Center, Guangdong Peizheng College, Guangzhou 510830, China

Abstract

Sub-micron gratings have novel diffraction properties, including high-efficiency and polarization-dependent diffraction. The detailed fabrication process of fused-silica sub-micron gratings especially the grating mask was described, which can be fabricated using holographic interference recording and inductively coupled plasma (ICP) dry etching technology. Deep-etched fused-silica sub-micron gratings were obtained for period 890 nm with different depths, whose aspect ratios can reach the maximum 6.7 for an etched depth of 3.0 m. It demonstrates that the holographic recording together ICP etching is an effective method for fabricating fused-silica gratings, which are useful elements in a variety of optical systems.

Keywords

Sub-micron grating, Holography, Inductively coupled plasma, Fused silica.

Citation

B. WANG, Y. LI, Fabrication of fused-silica sub-micron gratings with high aspect ratio by transfer holographic resist masks with ICP dry etching, Optoelectronics and Advanced Materials - Rapid Communications, 4, 10, October 2010, pp.1465-1468 (2010).

Submitted at: Aug. 18, 2010

Accepted at: Oct. 14, 2010