Our site saves small pieces of text information (cookies) on your device in order to deliver better content and for statistical purposes. You can disable the usage of cookies by changing the settings of your browser. By browsing our site without changing the browser settings you grant us permission to store that information on your device.
K. W. LAM1, H. P. CHAN1,* , M. A. UDDIN1
Failure analysis of a device has an important part to play in determining the causes of device failure and ways for making and using the devices to achieve greater reliability. Therefore an investigation was carried out for failure analyzing of adhesive bonded optical splitter packages using thermal cycling as an acceleration method. An optical splitter module simply composed of Y-branching waveguide devices on a substrate connected to and from optical fiber. However, it requires a lot of different materials with different properties to package such optical splitter in a case. As the thermomechanical properties of these different materials are normally quite different among each other, the thermal stress is induced due to the variation in coefficient of thermal expansion (CTE), hence affecting the optical performance and longterm reliability of the device. Therefore, an investigation was carried out to study the effect of housing on the reliability of adhesive bonded optical splitter modules with reference to the Telcordia requirements. A significant degradation in performance was found for the packaged splitter in housing during thermal cycling test. This is mainly due to the stressinduced misalignment effects between the PLC chip & coupling fibers, and also fiber bending in the housing. The finite element method (FEM) was then employed to confirm of the experimental findings. This study can provide important dictation in the reliable packaging of optical splitter with minimizing the CTE mismatch effects.
Optical splitter, Adhesive bonding, Reliability, Thermal cycling, Coefficient of thermal expansion (CTE) mismatch, Insertion loss.
K. W. LAM, H. P. CHAN, M. A. UDDIN, Failure analysis of adhesive bonded planar lightwave circuit (PLC) based optical splitter packages, Optoelectronics and Advanced Materials - Rapid Communications, 3, 10, October 2009, pp.998-1004 (2009).
Submitted at: Feb. 20, 2009
Accepted at: Oct. 2, 2009
Optoelectronics and Advanced Materials - Rapid Communications
(2023): 0.5 - 2023 Journal Citation Reports (Clarivate Analytics, 2024)
Active accounts were imported to the new platform and assigned a random password by default. In order to access your account you need to access the login page and go through the Lost Password dialog (involves the system sending you an email with instructions) in order to reset your password. This step is necessary as passwords are kept in hashed form and the new platform uses modern hashing algorithms incompatible with the previous ones.