Abstract
A comparative study is performed on the difference of degradation behaviors between Al0.27Ga0.73N/GaN and lattice-matched
In0.17Al0.83N/GaN Schottky barrier diodes (SBDs). The results indicate that, the degradation of InAlN/GaN SBDs exhibits
absolutely lower “critical voltage” and more serious deterioration than that of AlGaN/GaN SBDs in step-stress experiments.
By fitting the experimental data with various transport models and testing the dislocation density using
cathode-luminescence microscope, a model associating with traps is proposed to address the current degradation behaviors
in InAlN/GaN SBDs, which emphasizes that the enhanced Fowler-Nordheim tunneling process due to a thinner triangular
barrier after stress is mainly responsible for degradation.
Keywords
AlGaN/GaN, Lattice-matched InAlN/GaN, Schottky barrier diodes, Leakage current, Degradation.
Citation
J. REN, W. J. Li, L. N. SU, Leakage current degradation in lattice-matched In0.17Al0.83N/GaN Shottky barrier diodes, Optoelectronics and Advanced Materials - Rapid Communications, 15, 3-4, March-April 2021, pp.176-179 (2021).
Submitted at: Oct. 14, 2018
Accepted at: April 7, 2021