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Modeling and analysis of E-shaped birefringent photonic crystal fiber for temperature sensing applications

MANISHA SINGH1,* , SHIPRA1, SHAHIRUDDIN2

Affiliation

  1. Department of Electronics and Communication Engineering, Birla Institute of Technology, Patna Campus, Patna 800014, India
  2. Department of Electronics and Communication Engineering, Bakhtiyarpur College of Engineering, Bakhtiyarpur 803212, India

Abstract

In many medicinal, environmental, and industrial applications, temperature measurement is a crucial parameter that needs to be monitored. A temperature-sensing E-shaped photonic crystal fiber is designed, with the core initially filled with air and compared the outcome with the core filled with propanol. With an emphasis on their structure, sensing processes and performance characteristics, this research investigates the integration of PCF for sensing temperature. The proposed E-shaped PCF is simulated using finite element method (FEM) in R-soft software. For both air-filled core and propanol filled core, different parameters such as birefringence, temperature, and temperature sensitivity are calculated at different wavelength ranging from 1 μm to 1.7 μm. The sensitivity of the designed structure ranges from -1.439 nm/˚C to -1.192 nm/˚C after filling propanol in the wavelength 1 μm to 1.7 μm range. And for air filled PCF the sensitivity of the designed structure ranges from -1.491 nm/˚C to -1.281 nm/˚C in the same wavelength from 1 μm to 1.7 μm range. The higher value of Birefringence is 7.62×10-2 which is calculated after filling propanol and that of for air filled air hole is 6.61×10-2. The main aim of the designed PCF is to focus on their potential as next-generation sensors that can overcome the drawbacks of conventional temperature sensor while providing greater functionality and versatility.

Keywords

Photonic crystal fiber, Finite element method, Temperature sensitivity.

Citation

MANISHA SINGH, SHIPRA, SHAHIRUDDIN, Modeling and analysis of E-shaped birefringent photonic crystal fiber for temperature sensing applications, Optoelectronics and Advanced Materials - Rapid Communications, 20, 1-2, January-February 2026, pp.1-7 (2026).

Submitted at: Aug. 12, 2025

Accepted at: Feb. 2, 2026