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S. V. SAVU1,* , I. D. SAVU1, G. C. BENGA1, I. CIUPITU1
Hybrid US-Laser heating process can be applied to bond wires on pads for electrical and electronics purposes. The process has different versions. This version consists of preheating of the base materials by US vibration followed by simultaneous application of US and laser heat sources. The transferred power of the hybrid system to the surface of the wire was evaluated and the obtained value was around 550 W for the adopted parameters. The transferred power produced partial melting of the base metals (silver and copper) and it produced, in low areas, the eutectic Ag+28.1% Cu. It was examined the structure of the bond and were analyzed the hardness and the electrical resistance of the bond. The microscopic examination revealed the flowing of the base materials as well as the area with mixing in the solid-state of the two base materials. The hardness revealed low susceptibility to cracking. The electrical resistance has been influenced by the specific times (US cleaning time, hybrid process time). Other process parameters bring low significant influence on the electrical resistance of the bond..
Hybrid US-Laser heating process, Electrical connection, Silver wire on copper pad, Susceptibility to cracking, Electrical resistance.
S. V. SAVU, I. D. SAVU, G. C. BENGA, I. CIUPITU, Study of functional characteristics of the hybrid US-laser bonds, Optoelectronics and Advanced Materials - Rapid Communications, 11, 9-10, September-October 2017, pp.580-585 (2017).
Submitted at: Feb. 4, 2017
Accepted at: Oct. 10, 2017
Optoelectronics and Advanced Materials - Rapid Communications
(2023): 0.5 - 2023 Journal Citation Reports (Clarivate Analytics, 2024)
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