Study on a-plane GaN etching residual stress using Raman scattering
WANG DANG-HUI1,2,*
,
HAO YUE1,
ZHANG JIN-CHENG1,
XU SHENG-RUI1,
BI ZHI-WEI1,
ZHAO SHENG-LEI1,
MENG FAN-NA1,
XUE XIAO-YONG1,
ZHANG LIN-XIA1
Affiliation
- State Key Lab. of Fundamental Science on Wide Band-Gap Semiconductor Technology School of Microelectronics, Xidian University, Xi’an 710071, China
- School of Materials Science and Engineering of Xi’an ShiYou University, Xi’an 710065, China
Abstract
In this study, we have studied the etching residual stress for a-plane GaN films grown on r-plane (1102) sapphire substrate
with three different structures by low-pressure metal-organic vapor deposition (LPMOCVD). Scanning electron microscopy
(SEM) and Raman scattering have been employed to study the surface morphology and residual stress before and after
KOH solution etching. The three phonon modes of E2 (high), A1 (TO) and E1 (TO) and surface etching morphology of a-plane
GaN have been observed. We calculated the residual stress using the biaxial elastic stress theory. Conclusions show that E2
(high) phonon shifts decrease after etching with KOH solution for a-plane GaN epilayer, which shows that KOH solution
etching make the residual stress release. Based on the results, we indicated that there exists an approximate linear relation
between residual stress etched by KOH solution and biaxial elastic stress system in a-plane GaN epilayers..
Keywords
Residual stress, Metal organic chemical vapor deposition, Raman frequency shift, KOH solution etching.
Citation
WANG DANG-HUI, HAO YUE, ZHANG JIN-CHENG, XU SHENG-RUI, BI ZHI-WEI, ZHAO SHENG-LEI, MENG FAN-NA, XUE XIAO-YONG, ZHANG LIN-XIA, Study on a-plane GaN etching residual stress using Raman scattering, Optoelectronics and Advanced Materials - Rapid Communications, 6, 7-8, July-August 2012, pp.761-764 (2012).
Submitted at: March 14, 2012
Accepted at: July 19, 2012