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PENG SONG1,2, LUQIAO YIN3,2,* , YANG BAI1, JIANHUA ZHANG1,2
The life of light emitting diode (LED has a great relationship with its thermal resistance. As a part of the total thermal resistance, thermal spreading resistance may also affect the reliability of LED. To study the influence of LED packaging substrate for thermal spreading resistance, this article analyzes the influence of different parameters for thermal spreading resistance of single heat source. Results show that the thermal conductivity, the thickness of substrate and the heat source area has great influence on thermal spreading resistance. But the convection coefficient is not so important. And the more the heat source deviates from the center of substrate, the greater the thermal spreading resistance will be. Second ly , based on LED devices with d irect b ond c opper ceramics (substrate, thermal spreading resistance with two heat transfer layers are analyzed by analytical solution and simulation . The influences of different thickness of copper and ceramics for thermal spreading resistance and total thermal resistance are analyzed. Results show that with the increase of the thickness of copper and ceramics, the thermal spreading resistance and the total thermal resistance are decrease, and the effect of copper is more apparent. So the reasonable design of packaging substrate for LED packaging can reduce the thermal resistance and improve the performance of LED heat dissipation..
Thermal spreading resistance, LED, Substrate, Simulation.
PENG SONG, LUQIAO YIN, YANG BAI, JIANHUA ZHANG, Study on the i nfluence s of the s ubstrate parameters for t hermal s preading r esistance of light emitting diode, Optoelectronics and Advanced Materials - Rapid Communications, 9, 9-10, September-October 2015, pp.1075-1080 (2015).
Submitted at: June 26, 2015
Accepted at: Sept. 9, 2015
Optoelectronics and Advanced Materials - Rapid Communications
(2023): 0.5 - 2023 Journal Citation Reports (Clarivate Analytics, 2024)
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